C.S.P Module

調色調光系列產品特色

• 倒裝C.S.P雙色溫貼片結構，倒裝芯片熱量直接傳導至基板，散熱效果更好。
• 燈板專利雙色溫線路分布結構，配光均勻，光型美觀，調控容易，電性分布合理。
• 發光面小，單位面積光效高，二次光學設計更靈活。
• 倒裝C.S.P燈珠經光電分選，色溫一致性比COB高。
• 倒裝C.S.P耐高溫，耐大電流使用特性，壽命更長。
• 燈珠各體超廣角交互增亮光型，光效超高。
• 可接受訂製更小燈板、色溫、瓦數及芯片功率以滿足特殊設計要求。
   
• C.S.P bi-color patch layout, the heat of flip chip directly dissipated to substrate, the cooling effect is perfect.
• Patented bi-color layout design, equated light distributions, graceful lighting effect, smoothly adjustable, scientific electrical designs.
• Smaller light emittion area, high lumen/area, makes secondary optical design more easier & savings.
• C.S.P have been sorted, the uniformity of color temperature is higher than COB.
• C.S.P could be operated at high temperature and heavy current makes engines life longer.
• Each super-wided beam angle C.S.P increases the light saturation, higher light efficiency.
• Customers design request is acceptable: Smaller light board, various color temperature, wattages and various powers of C.S.P chip to meet speciflc design requirements.

大功率光引擎系列產品特色

• 倒裝C.S.P貼片結構，倒裝芯片熱量直接傳導至基板，散熱效果更好。
• 燈板為專利線路分布結構，配光均勻，光效更高，光型美觀，電性散熱分布平均。
• 倒裝C.S.P燈珠經光電分選，色溫一致性比COB高。
• 倒裝C.S.P耐高溫，耐大電流使用特性，壽命更長。
• 燈珠各體超廣角交互增亮光型，光效超高。
• 可接受訂製更小燈板、色溫、瓦數及芯片功率以滿足特殊設計要求。
   
• C.S.P (Chip Scale Package) light source adopted.
• Patented C.S.P light engine design, the heat of flip chip directly dissipated to substrate, the cooling effect is perfect.
• Patented circuit layout design, equated light distributions, graceful lighting effect, scientific electrical circuit designed.
• C.S.P have been sorted, the uniformity of color temperature is higher than COB.
• C.S.P light engine could be operated at higher temperature and heavy current than COB and 2835 SMT type.
• Each super-wided beam angle C.S.P increases the light saturation, higher light efficiency.
• Customers design request is acceptable: Smaller light board, various color temperature, wattages and various powers of C.S.P chip to meet speciflc design requirements.

軌道燈光引擎系列​產品特色

• 倒裝C.S.P雙色溫貼片結構，倒裝芯片熱量直接傳導至基板，散熱效果更好。
• 燈板為專利線路分布結構，光效更高，配光均勻，光型美觀，電性散熱分布平均。
• 倒裝C.S.P燈珠經光電分選，色溫一致性比COB高。
• 倒裝C.S.P耐高溫，耐大電流使用特性，壽命更長。
• 燈珠各體超廣角交互增亮光型，光效超高。
• 可接受訂製更小燈板、色溫、瓦數及芯片功率以滿足特殊設計要求。
   
• C.S.P (Chip Scale Package) light source adopted.
• Patented C.S.P light engine design, the heat of flip chip directly dissipated to substrate, the cooling effect is perfect.
• Patented circuit layout design, equated light distributions, graceful lighting effect, scientific electrical circuit designed.
• C.S.P have been sorted, the uniformity of color temperature is higher than COB.
• C.S.P light engine could be operated at higher temperature and heavy current than COB and 2835 SMT type.
• Each super-wided beam angle C.S.P increases the light saturation, higher light efficiency.
• Customers design request is acceptable: Smaller light board, various color temperature, wattages and various powers of C.S.P chip to meet speciflc design requirements.